Select a Process for LC Connectors

	LC-UPC Connector (1.25 mm) Domaille Polisher
	LC-APC Connector (1.25 mm) Domaille Polisher
	LC-UPC Connector (1.25 mm) OFL-15
	LC-UPC Connector (1.25 mm) Nanometer Polisher
	LC-UPC Connector (1.25 mm) Seikoh Giken 550
	LC Multimode Connector (1.25 mm) Nanometer Polisher

The processes offered here are not exact and variations are available. These processes should be used as a guide only and the user will need to make adjustments to suit his own requirements. We again state that neither Tech Optics nor 3M offer any guarantee or accept any liability for these processes, you will find that using 3M polishing films and following the guidelines of the selected machine, you will achieve a process that will only require small adjustments to obtain the result you require.

Back to Process Selection Table

Back to Process Selection Table

Back to Process Selection Table

LC-UPC Connector (1.25 mm) Nanometer Polisher

Step	Polishing Film			Process
	Micron	Mineral	Product ID	Pressure	Time	Pad
Step 1	15 µm	SiC	461X (468X w/ PSA)	by hand	remove nub	n/a
Step 2	15 µm	SiC	461X (468X w/ PSA)	see above	**	80 D
Step 3	6 µm	diamond	662XW (666XY w/ PSA)	see above	**	80 D
Step 4	3 µm	diamond	662XW (666XY w/ PSA)	see above	**	80 D
Step 5	1 µm	diamond	662XW (666XY w/ PSA)	see above	**	80 D
Step 6	Finishing film	SiO2	863XW	see above	**	80 D

** For times, contact our technical support service at techsupport@techoptics.com
Note: Pressures on the Nanometer machine will vary according to the number of connectors in the plate
Back to Process Selection Table

LC Multimode Connector (1.25 mm) Nanometer Polisher

Step	Polishing Film		Process
	Micron	Mineral	Product ID	Pressure	Time	Pad
Step 1	15 µm	SiC	461X (468X w/ PSA)	by hand	remove nub	n/a
Step 2	15µm	SiC	461X (468X w/ PSA)	see above	**	80 D
Step 3	6 µm	diamond	662XW (666XY w/ PSA)	see above	**	80 D
Step 4	3 µm	diamond	662XW (666XY w/ PSA)	see above	**	80 D
Step 5	1 µm	diamond	662XW (666XY w/ PSA)	see above	**	80 D
Step 6	0.05 µm	Aluminium Oxide	263X	see above	**	80 D

** For times, contact our technical support service at techsupport@techoptics.com
Note: Pressures on the Nanometer machine will vary according to the number of connectors in the plate
Back to Process Selection Table

LC-UPC Connector (1.25 mm) Seikoh Giken 550

Step	Polishing Film		Process
	Micron	Mineral	Product ID	Pressure	Time	Pad
Step 1	3µm	SiC	462X	by hand	remove nub	n/a
Step 2	1µm	diamond	662XW	unclamped	**	glass
Step 3	1µm	diamond	662XW	clamped	**	glass
Step 4	0.5µm	diamond	662XW	clamped	**	80 D
Step 5	Finishing film	SiO2	863XW	clamped	**	80 D

** For times, contact our technical support service at techsupport@techoptics.com
Back to Process Selection Table

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